Conventional processes
By the time an advanced chip is fabricated, more than 95% of the wafer material has been wasted and ground to dust using legacy manufacturing methods. What’s more, advanced wafer materials are the largest cost item in manufacturing next generation chips.
Wafering
Up to 50% wasted material
Device thinning
Up to 90% wasted material
We believe there’s a better way to manufacture advanced chips. Our Sonic Lift-off technology uses sound to separate devices from substrates, enabling substrate reuse.