Technology Is Built On Us
Enabling next generation semiconductor manufacturing by harnessing the power of sound.
We help next generation semiconductor manufacturers reduce waste and cost by enabling thin device lift-off and substrate re-use.
Tomorrow's semiconductor devices are increasingly based on next generation substrate materials, such as SiC, GaN, GaAs and others. These materials yield smaller devices, higher performance and higher efficiency, unlocking new applications in power electronics, sensing, communications and more.
Legacy manufacturing techniques for wafering and device thinning often waste 90% or more of the substrate material. Additionally, these substrate materials can consume up to 50% of the total device manufacturing cost.
Sonic Lift-off harnesses the power of sound to separate thin devices from semiconductor substrates, enabling substrate re-use. This elegant alternative to back-grinding is fast, wastes no material, and leaves behind high quality surfaces with micron precision.
Technological revolutions across multiple industries are being held back by manufacturing cost and waste problems. Crystal Sonic’s patented technology will enable advanced semiconductor manufacturers to reduce waste and lower costs dramatically, enabling next generation technologies.