Next generation semiconductors
Chips that power tomorrow’s advanced data centers, sensors, photonics, wireless communications and quantum computing are based on next generation materials such as SiC, GaN, GaAs, AlN, LiNbO3 and others. These materials offer higher performance and efficiency, unlocking new applications and capabilities, but come at a high cost.
We help next generation semiconductor manufacturers reduce waste and cost by enabling wafer re-use through our patented Sonic Lift-off technology.
Sonic Lift-off uses sound waves to gently lift thin devices off their semiconductor base, allowing the base to be reused. This quick, efficient process produces no waste and leaves a smooth, precise surface, making it a superior alternative to traditional grinding methods.
WHY IT MATTERS
Technological revolutions across multiple industries are being held back by manufacturing cost and waste problems. Crystal Sonic’s patented technology enable advanced semiconductor manufacturers to reduce waste and lower costs dramatically, enabling next generation technologies.
